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Printed Circuit Board Assembly

We offer contract electronic assemblies, focusing on small and medium batch sizes, offering a range of turnarounds from 3 working days upwards, depending on the client’s requirements.

By focusing on small and medium batch sizes, it allows us to create an efficient manufacturing environment, by using the best appropriate technology within our bespoke manufacturing process.

The need to constantly process many different production batches enables us to have the capability to set up both new and repeat jobs effectively and efficiently.

Capability

Depending on client requirements, we are able to manufacture quantities ranging from single boards to many thousands.

We offer both through hole and SMD assembly from 0402, 0603, 0805, 1206, 2515 etc., chips to SOP, PLCC, QEP, BGA, CSP, connector and unusual shaped components.

Equipment on site includes:

  • Stencil Printer
  • Neoden K1830 Placement Machine
  • Dima Breeze Reflow Oven
  • Other Services

    • Component procurement and kitting
    • Wiring and box build
    • Test and measurement tools